Wirebond removal for BGA packaged semiconductor chips
Centre for Development of Advanced Computing (C-DAC) · Thiruvananthapuram, Kerala · Electronics & Instrumentation · open
Key facts
- Published: 19 Aug 2026
- Closing date: 01 Sep 2026
- Status: open
- Ministry: Ministry of Electronics and Information Technology
- Department: Department of Electronics and Information Technology
- Office: Thiruvananthapuram
Description
Tender for the supply of wirebond removal service for BGA packaged semiconductor chips, with a bid validity of 90 days from the end date, issued by the Centre for Development of Advanced Computing (C-DAC) under the Ministry of Electronics and Information Technology, Thiruvananthapuram.
Eligibility & requirements
- Startup relaxation: No
- MSE relaxation: No
New to these terms? Read how tender eligibility criteria work.
Commercial terms
- Bid type: Packet Bid
- Evaluation: value wise evaluation
- Make in India (MII): Yes
- MSE preference: Yes
Line items (1)
- Wirebond removal for BGA packaged semiconductor chips — Qty: 1 service
1 tender document(s) available — sign up to download.
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