Wirebond removal for BGA packaged semiconductor chips
Centre for Development of Advanced Computing (C-DAC) · Thiruvananthapuram, Kerala · Electronics & Instrumentation · open
Key facts
- Published: 11 Nov 2026
- Closing date: 27 Nov 2026
- Status: open
- Status as of: 14 Nov 2026 09:52 UTC
- Ministry: Ministry of Electronics and Information Technology
- Department: Department of Electronics and Information Technology
- Office: Thiruvananthapuram
Description
Global tender for wirebond removal for BGA packaged semiconductor chips. Items are to be supplied to C-DAC, Thiruvananthapuram, Kerala. Payment is 100% within 30 days after delivery and acceptance.
Eligibility & requirements
- Startup relaxation: Yes
- MSE relaxation: No
New to these terms? Read how tender eligibility criteria work.
Commercial terms
- Bid type: Two Packet Bid
- Evaluation: Total value wise evaluation
- Make in India (MII): No
- MSE preference: Yes
1 tender document(s) available — sign up to download.
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