Supply of Motherboards, Pressure Roller, Teflon Sleeve, RAM, UPS
Indian Army · Bathinda · Electronics & Instrumentation · awarded
Key facts
- Published: 26 Aug 2026
- Closing date: 05 Sep 2026
- Status: awarded
- Ministry: Ministry of Defence
- Department: Department of Military Affairs
Description
Tender for supply of motherboards (H510H6 M2, B560H6 M7), pressure roller, Teflon sleeve, 8GB DDR4 RAM, and 1 KVA UPS for the Indian Army, Ministry of Defence, Department of Military Affairs.
Eligibility & requirements
- Past performance: 60%
- Startup relaxation: No
- MSE relaxation: Yes
- Documents required: Turnover Criteria, Udyam Certificate
New to these terms? Read how tender eligibility criteria work.
Commercial terms
- Bid type: Two Packet Bid
- Evaluation: value wise evaluation
- Make in India (MII): No
- MSE preference: Yes
Line items (6)
- Motherboard H510H6 M2 — Qty: 1 piece
- Motherboard B560H6 M7 — Qty: 1 piece
- Pressure Roller
- Teflon Sleeve
- RAM 8GB DDR4 — Qty: 1 module
- UPS 1 KVA — Qty: 1 unit
1 tender document(s) available — sign up to download.
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