Semiautomatic Wedge & Ball Wire Bonder
Indian Institute Of Technology (IIT) · Varanasi, Uttar Pradesh · Electronics & Instrumentation · open
Key facts
- EMD: ₹72K
- Published: 05 Oct 2026
- Closing date: 26 Oct 2026
- Status: open
- Status as of: 05 Oct 2026 22:12 UTC
- Ministry: Ministry Of Education
- Department: Department Of Higher Education
- Office: Office Of The Registrar, IIT (BHU), Varanasi - 221005, U.P.
Description
Tender for supply of Semiautomatic Wedge & Ball Wire Bonder with a quantity of 1 unit, including technical specifications, EMD, and purchase preferences. The bid is governed by specific terms including MII and MSE preferences, and includes conditions for delivery, qualification, and compliance.
Eligibility & requirements
- Experience required: 3 years
- Past performance: 80%
- Startup relaxation: Yes
- MSE relaxation: Yes
- Documents required: Experience proof, Turnover proof, OEM authorization, Certificates
New to these terms? Read how tender eligibility criteria work.
Commercial terms
- Bid type: Packet Bid
- Evaluation: value wise evaluation
- Make in India (MII): Yes
- MSE preference: Yes
Line items (1)
- Semiautomatic Wedge & Ball Wire Bonder — Qty: 1 piece
1 tender document(s) available — sign up to download.
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