Multilayer PCB Fabrication with Components and Assembly
Institute for Plasma Research · Gujarat · Electronics & Instrumentation · open
Key facts
- Published: 04 Aug 2026
- Closing date: 27 Aug 2026
- Status: open
- Ministry: Department of Atomic Energy
- Department: Department of Atomic Energy
- Office: West Zone
Description
Tender for the fabrication of multilayer printed circuit boards with components and assembly, including related specifications and compliance requirements, issued by the Department of Atomic Energy for the Institute for Plasma Research.
Eligibility & requirements
- Startup relaxation: No
- MSE relaxation: No
- Documents required: Experience/Turnover exemption documents, Local content certificate
New to these terms? Read how tender eligibility criteria work.
Commercial terms
- Bid type: Packet Bid
- Evaluation: value wise evaluation
- Make in India (MII): Yes
- MSE preference: Yes
Line items (1)
- Multilayer PCB Fabrication with Components and Assembly — Qty: 1 unit
1 tender document(s) available — sign up to download.
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