Heat Sink for Artix-7 FPGA, High Performance Maxiflow with Thermal Tape Attachment
ITI Limited · Bangalore, Karnataka · Electronics & Instrumentation · open
Key facts
- Published: 05 Sep 2026
- Closing date: 26 Sep 2026
- Status: open
- Ministry: Ministry of Communications
- Department: Department of Telecommunications
- Office: Iti Bangalore
Description
Tender for supply of 2400 units of high performance heat sinks for Artix-7 FPGA, including thermal tape attachment, under the Department of Telecommunications, ITI Limited, Bangalore. Bid validity is 180 days from the end date, with detailed technical specifications and eligibility criteria provided.
Eligibility & requirements
- Startup relaxation: No
- MSE relaxation: No
- Documents required: OEM Authorization Certificate, BoQ compliance documents
New to these terms? Read how tender eligibility criteria work.
Commercial terms
- Bid type: Packet Bid
- Evaluation: item wise evaluation
- Make in India (MII): Yes
- MSE preference: Yes
Line items (1)
- Heat Sink for Artix-7 FPGA — Qty: 2400 unit
1 tender document(s) available — sign up to download.
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