Die Bonder and Wedge and Ball Bonder
Indian Institute of Technology (IIT) · Gandhinagar, Gujarat · Electronics & Instrumentation · open
Key facts
- EMD: ₹1.7L
- Published: 29 Sep 2026
- Closing date: 20 Oct 2026
- Status: open
- Ministry: Ministry of Education
- Department: Department of Higher Education
- Office: IIT Gandhinagar
Description
Tender for supply, installation, testing, commissioning of Die Bonder and Wedge and Ball Bonder, including training and statutory clearances, with EMD and ePBG provisions, and preference policies for MII and MSE bidders.
Eligibility & requirements
- Startup relaxation: No
- MSE relaxation: No
- Documents required: Certificate of registration, Authorization certificate (if applicable), Udyam Certificate (if applicable)
New to these terms? Read how tender eligibility criteria work.
Commercial terms
- Bid type: Packet Bid
- Evaluation: value wise evaluation
- Make in India (MII): Yes
- MSE preference: Yes
Line items (1)
- Die Bonder and Wedge and Ball Bonder — Qty: 1 Unit
1 tender document(s) available — sign up to download.
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