TI Module Assembly
Indian Army · Electronics & Instrumentation · awarded
Key facts
- Published: 22 Jul 2026
- Closing date: 01 Aug 2026
- Status: awarded
- Ministry: Ministry of Defence
- Department: Department of Military Affairs
Description
Tender for the supply of TI Module Assembly with specifications conforming to IS 8931, including related components such as interface modules, safety caps, and thermal imaging equipment. The tender is issued by the Indian Army under the Ministry of Defence, Department of Military Affairs.
Eligibility & requirements
- Experience required: 3 years
- Past performance: 50%
- Startup relaxation: No
- MSE relaxation: No
- Documents required: Audited Balance Sheets, CA/Cost Accountant Certificate
Commercial terms
- Bid type: Packet Bid
- Evaluation: value wise evaluation
- Make in India (MII): Yes
- MSE preference: Yes
Line items (1)
- TI Module Assembly — Qty: 1 Nos
1 tender document(s) available — sign up to download.