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Tender for Rotor Shaft, Set of Teflon Balls, Set of Gasket Packaging, Pump Pulley, Motor Pulley

Semiconductor Laboratory · Mechanical Components & Spares · open

Key facts

Description

Tender issued by the Ministry of Electronics and Information Technology for the supply of various mechanical components including rotor shafts, Teflon balls, gasket packaging, pump pulleys, and motor pulleys. The bid is open from August 13, 2026, to September 3, 2026, with a validity of 180 days from the end date. The organization involved is the Semiconductor Laboratory under the Department of Electronics and Information Technology.

Eligibility & requirements

Commercial terms

Line items (5)

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