Integrated Signal Processing and Electronics Module for Configurable Ultraspectral Imaging Payload
Office of Dg (ecs) · Electronics & Instrumentation · open
Key facts
- Tender value: ₹17.7L
- EMD: ₹17.7L
- Closing date: 29 Jul 2026
- Status: open
- Ministry: Ministry of Defence
- Department: Department of Defence Research & Development
Description
Tender for the supply of one integrated signal processing and electronics module for configurable ultraspectral imaging payload, issued by the Ministry of Defence, Department of Defence Research & Development, Office of Dg (ecs). The bid is valid for 180 days from the end date, with a bid end date of 29-07-2026 and a bid opening at 18:30 on the same day. The estimated bid value is approximately 17.67 lakh INR, with an EMD of 17.67 lakh INR payable to State Bank of India. The tender includes specifications for a printed circuit board, digital signal processing board, and related components, with evaluation based on total value. The procurement emphasizes Make-in-India and MSE preferences, with specific experience and turnover criteria for bidders.
Eligibility & requirements
- Experience required: 3 years
- Past performance: 55%
- Startup relaxation: Yes
- MSE relaxation: Yes
- Documents required: Contract copies, Delivery certificates, CRAC certificates, Audited Balance Sheets
Commercial terms
- Bid type: Two Packet Bid
- Evaluation: value wise evaluation
- Make in India (MII): Yes
- MSE preference: Yes
Line items (1)
- Integrated Signal Processing and Electronics Module — Qty: 1 Nos
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