Flip chip bonder
Office of Dg (Med & Cos) · Electronics & Instrumentation · open
Key facts
- Published: 31 Jul 2026
- Closing date: 11 Aug 2026
- Status: open
- Ministry: Ministry of Defence
- Department: Department of Defence Research & Development
Description
Tender for the supply of a flip chip bonder with a bid validity of 180 days, issued by the Ministry of Defence, Department of Defence Research & Development, Office of Dg (Med & Cos). The tender includes specifications, evaluation criteria, and preferences for MII and MSE suppliers.
Eligibility & requirements
- Startup relaxation: No
- MSE relaxation: No
Commercial terms
- Bid type: Two Packet Bid
- Evaluation: value wise evaluation
- Make in India (MII): Yes
- MSE preference: Yes
Line items (1)
- Flip chip bonder — Qty: 1 unit
1 tender document(s) available — sign up to download.